MEMS 2016 - The 29th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2016) - Shanghai International Conference Center (SHICC) - 2727 Riverside Ave, Pudong, Shanghai, China
KMEMS 2016 - The 18th Korean MEMS Conference
APCOT 2016 - Asia-Pacific Conference of Transducers and Micro-Nano Technology 2016 - Kanazawa, Japan
Korea MEMS 2016
KIE 2016
MEMS 2017 - IEEE International Conference on Micro Electro Mechanical Systems - Las Vegas, USA
Transducers 2017 - The 19th International Conference on Solid-State Sensors, Actuators and Microsystems - Kaohsiung, Taiwan
Power MEMS 2017 - The 17th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications - Kanazawa, Japan
ICAE 2017 - The Fourth International Conference on Advanced Electromaterials - Ramada Plaza, Jeju, Korea
Invited Seminar 2017/12/18
This premier event for the biosensors community - the largest in the field - will celebrate its 28th anniversary with another excellent line-up of plenary speakers, high quality contributed oral talks and large poster sessions.
Topics include:
- Bioelectronics (including biocomputing, biofuel cells and electronic noses)
- Commercial biosensors, manufacturing and markets
- DNA chips, nucleic acid sensors and aptasensors
- Enzyme-based biosensors
- Immunosensors
- Lab-on-a-chip
- Microfluidics and immobilisation technology
- Mobile diagnostics and personal health
- Nanobiosensors, nanomaterials & nanoanalytical systems
- Natural & synthetic receptors (including MIPs)
- Organism- and whole cell-based biosensors
- Printed biosensors and microfabrication
- Proteomics, single-cell analysis and cancer-cell detection
- Signal transduction technology (including magneto, piezo, optical and direct electrochemical techniques)
- Theranostics & implantable sensors
A major exhibition will run alongside the congress sessions.
Executive chair
Anthony P F Turner, Linköping University, Sweden
Plenary speakers
- David C. Cullen, Cranfield University, UK
- Emmanuel Delamarch, IBM Zurich, Switzerland
- David C. Klonoff, Mills-Peninsula Health Services and UCSF, USA
- Kyu-jin Cho, Seoul National University, Korea
- Kevin Plaxco, University of California Santa Barbara, USA
- John Rogers, Northwestern University, USA
The major areas of activity in the development of Sensor, Actuators and Transducers solicited and expected at this conference include but are not limited to:
- Mechanical/Physical Sensors and Microsystems
- Materials, Fabrication, and Packaging Technologies
- Nanoscale Devices and Nanomaterials
- Transducers with Soft, Flexible or Composite Materials
- Chemical and Environmental Sensors and Microsystems
- Bio-Sensors and Bio-Microsystems
- Medical Microsystems
- Microfluidics (non-bio)
- Energy and Power MEMS
- Acoustic Microdevices and RF MEMS
- Integrated Photonics and Optical MEMS
The conference will begin on Sunday, 23 June 2019 with short courses providing a scholar introduction and overview of some selected topics of interest to academics and professionals to get up to date with the latest trends in the field. The topics of the short courses will be announced, shortly. Sunday 23 will also open the conference registration and will have a Welcome Reception for attendees to meet and greet. The conference technical program will begin Monday 24 June morning with plenary sessions and then breakout into parallel sessions, as well as industry sessions and poster session throughout the duration of the conference. The Exhibition portion will take place Monday through Thursday 27 June 2019, giving opportunities for companies, start-ups and scientific associations to demonstrate their latest products and services. We will design the program such that there are plenty of occasions for networking. Social events are being designed for family participation in Berlin and surrounding areas. The Berlin weather in June is typically warm and pleasant, with long enjoyable hours of daylight.
The 33rd IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2020) is one of the premier annual events reporting research results on every aspect of Microsystems technology. This conference reflects from the rapid proliferation of the commitment and success of the Microsystems research community. In recent years, the IEEE MEMS Conference has attracted more than 700 participants, 800+ abstract submissions and has created the forum to present over 200 select papers in podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees, presenters and exhibitors. IEEE MEMS 2020 will be held in Vancouver, British Columbia, from January 18 - 22, 2020. The major areas of activity in the development of MEMS solicited and expected at this conference include but are not limited to:
- Design, simulation and analysis tools with experimental verification
- Fabrication technologies and processes
- Silicon and non-silicon materials
- Electro-mechanical integration techniques
- Assembly and packaging approaches
- Metrology and operational evaluation techniques
- System architecture
The major areas of activity in the application of MEMS solicited and expected at this conference include but are not limited to:
- Mechanical, thermal, and magnetic sensors and actuators, and system
- Opto-mechanical microdevices and microsystems
- Fluidic microcomponents and microsystems
- Microdevices for data storage
- Microdevices for biomedical engineering
- Micro chemical analysis systems
- Microdevices and systems for wireless communication
- Microdevices for power supply and energy harvesting
- Nano-electro-mechanical devices and systems
- Scientific microinstruments
Hiking to Suraksan Mountain, 2020
Congratulation to all the graduates.
Graduation of Hyosang Yoon (PhD), Pukar Maharjan (PhD), Ashok Chhettri (PhD), Toyabur Rahman (PhD), Young Do Shin (Bachelor), Dongkyun Kim (Bachelor).
Congratulation to Hyunok Cho (PhD)
Hiking to Dobong Mountain, 2021
Winter Graduation 2022
