Compact Lattice-type LC Balun Embedded into FR-4 PCB with BaTiO3 Composite Film
In this paper, fully embedded lattice type LC balun into a PCB substrate was investigated for advanced RF SOP products with low cost and small size. The proposed balun was miniaturized by embedding high Q circular spiral inductors and MIM capacitors into the FR-4 PCB substrate. Especially, the area of embedded capacitor was extremely reduced by applying high dielectric composite RCC film which was comprised of BaTiO3 power and epoxy resin. These embedded capacitors exhibited excellent performance characteristics at high frequency regime by achieving the capacitance density ranged from 15 pF/mm2 to 25 pF/mm2. The embedded LC baluns had much smaller area than previously reported PCB based ones and excellent performance characteristics. The measured results were well agreed with 3D-EM simulated ones. They are promising for advanced RF SOP products with multi functionalities, small size, and low cost.
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