Design and Fabrication of Integrated film bulk acoustic resonator and filter on silicon nitride membrane
In this paper, fully integrated film bulk acoustic resonators (FBARs) and filter have been designed, fabricated, and characterized by using silicon bulk micromachining technology. The fabricated resonator is comprised of aluminum nitride (AlN) piezoelectric material sandwiched by two molybdenum (Mo) electrodes on top of silicon nitride thin membrane. The developed AlN piezoelectric film has 1.9° of FWHM (full width half maximum) of rocking curve and approximately 70 Mpa in tensile stress on top of the Mo electrode. The fabricated FBAR has a quality factor of 1530 in size of 200 × 200 μm2, insertion loss of −0.45 dB, and return loss of −28 dB, respectively. The fabricated FBAR ladder type filter is comprised of 7 resonators with 3 resonators in series and 4 resonators in parallel. It has insertion loss of −3.2 dB and ripple of 0.4 dB in pass band, absolute attenuation of 40 and 50 dB at 1.6–1.875 GHz and 2.110–2.170 GHz, respectively. The size of the fabricated FBAR filter is 1.2 mm × 1.4 mm before packaging and 3 mm × 3 mm after packaging, respectively. © 2006 Wiley Periodicals, Inc. Microwave Opt Technol Lett 48: 2230–2233, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21905
Similar Publications:
In this article, an actively formed dual anchor structure was newly designed and applied to improve the tuning range and mechanical reliability of an RF micr...
In this letter, fully embedded passive triplexer and quintplexer module into organic packaging substrate were presented for US CDMA handset applications. Fir...
In this article, compact quintplexer modules with apassive triplexer circuit were newly designed, implemented, comparedfor US-CDMA handset applications. The ...
In this article, lattice-type LC balanced-to-unbalanced (balun) embedded into a multilayered organic package substrate have been designed, fabricated, and ch...
In this article, fully embedded lumped LC-quadrature hybrid coupler are designed, fabricated, and characterized into multilayered organic packaging substrate...
In this article, fully embedded and miniaturized diplexer passive circuit device has been developed and characterized for dual‐band/mode CDMA handset appli...
In this article, fully embedded and miniaturized diplexer passive circuit device has been developed and characterized for dual-band/mode CDMA handset applica...
In this paper, fully embedded circular-stacked spiral inductors are investigated into a multilayered PCB substrate for low cost and miniaturized RF system on...
In this article, silicon bulk micromachined RF MEMS switch with four cantilever piezoelectric actuators has been designed, fabricated, and characterized for ...
This article presents a new circuit to generate a higher-order derivative Gaussian pulse for the impulse radio ultra-wideband(IR-UWB) communication systems. ...