FULLY EMBEDDED COMPACT DIPLEXER INTO ORGANIC PACKAGE SUBSTRATE FOR DUAL-MODE (GSM/DCS) HANDSET APPLICATIONS
In this paper, a fully embedded compact diplexer has been designed, fabricated, and characterized for small size and low cost dual-mode (GSM/DCS) handset applications. The diplexer is fully embedded into an organic packaging substrate and remarkably reduced in size and volume by using high Q embedded circular spiral inductors and high dielectric MIM (metal-insulator-metal) capacitors. The fabricated diplexer has insertion losses and isolations of max. −0.5 dB and min. −35 dB at 880–960 MHz and max. −0.9 dB and min. −22 dB at 1710–1880 MHz, respectively. The fabricated diplexer is the smallest one of the diplexers formed onto organic substrate. It has 3.4 × 4.7 × 0.77 mm3 in volume.
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