Fully Embedded Micro-Triplexer into PCB with BaTiO3 Film
In this paper, compact passive type triplexer was newly designed and fabricated for US-CDMA handset applications. The newly designed triplexer circuit was comprised of a diplexer, parallel resonant circuit, GPS SAW BPF, and its impedance matching circuit. It was realized by embedding all passive components into multi-layered PCB substrate with BaTiO3 organic composite film. Although the number of passive components to comprise the proposed triplexer and its size were dramatically reduced, its performance characteristics were much improved. It exhibited the measured insertion losses of −0.4 dB, −1.7 dB, and −1.3 dB and the measured isolation characteristics of −10 dB, −24 dB, and −21 dB at DCN, GPS, US-PCS band, respectively. The simulated and measured performance characteristics of fabricated triplexer were well agreed. The fabricated triplexer has a 4.0 × 3.0 mm2 size. Since it has excellent performance characteristics, small size/volume, and low cost, it can be directly applied for US-CDMA handsets.
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