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Low Temperature Fabrication and Characterization of Integrated Packaging-Compatible, Ferrite-Core Magnetic Devices

Low Temperature Fabrication and Characterization of Integrated Packaging-Compatible, Ferrite-Core Magnetic Devices

Integrated magnetic components compatible with organic (low-temperature) electronic packaging for miniature DC/DC converters and other power supply applications are investigated. Two inductor types have been fabricated incorporating a polymer/ferrite composite core, deposited and patterned at low temperature. For the fabricated inductors, inductances in the 0.5-1.5 /spl mu/H range and Q-factors of the order of 17 are achieved. In all cases, the incorporation of the polymer filled ferrite improved the characteristics of the integrated inductors.

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