Simulation and Fabrication of Embedded Capacitors for Organic-Based RF System on Packaging Applications
Embedded capacitor technology is one of the effective packing technologies for small size, high reliability, high performance and low cost of electric packaging systems. In this paper, the embedded capacitors were simulated and fabricated in the 8-layered printed circuit board employing standard PCB processes for RF SOP (System on package) applications. Usually, to reduce the size of embedded capacitors, high dielectric constant composites materials were employed. The composites of barium titanante (BaTiO3) powder and epoxy resin were employed in the dielectric materials for embedded capacitor applications. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of fabricated embedded capacitors was investigated. Parasitic inductance was developed mainly through via holes and it has almost same value for all capacitors. Frequency dependent capacitance values of fabricated embedded capacitors were well matched with those of simulated embedded capacitors. Temperature dependent capacitance and loss tangent of fabricated embedded capacitor were presented.
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