Simulation and Fabrication of Embedded Capacitors for Organic-Based RF System on Packaging Applications
Embedded capacitor technology is one of the effective packing technologies for small size, high reliability, high performance and low cost of electric packaging systems. In this paper, the embedded capacitors were simulated and fabricated in the 8-layered printed circuit board employing standard PCB processes for RF SOP (System on package) applications. Usually, to reduce the size of embedded capacitors, high dielectric constant composites materials were employed. The composites of barium titanante (BaTiO3) powder and epoxy resin were employed in the dielectric materials for embedded capacitor applications. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of fabricated embedded capacitors was investigated. Parasitic inductance was developed mainly through via holes and it has almost same value for all capacitors. Frequency dependent capacitance values of fabricated embedded capacitors were well matched with those of simulated embedded capacitors. Temperature dependent capacitance and loss tangent of fabricated embedded capacitor were presented.
Similar Publications:
In this paper, fully embedded lattice type LC balun into a PCB substrate was investigated for advanced RF SOP products with low cost and small size. The prop...
In this paper, compact passive type triplexer was newly designed and fabricated for US-CDMA handset applications. The newly designed triplexer circuit was co...
In this paper, FR-4 embedded RF spiral inductors with hetero dielectric layers were newly designed, fabricated, and characterized in order to improve their q...
In this paper, a fully embedded compact diplexer has been designed, fabricated, and characterized for small size and low cost dual-mode (GSM/DCS) handset app...
All of the biosensors which are commercially available are based on the enzymatic electrochemical analysis. Thus, they are disposable due to the use of the e...
In this paper, embedded passive components are investigated into the PCB substrate for low cost RF SOP applications. PCB embedded spiral inductors, MIM capac...
In this paper, embedded passive components are investigated into the PCB substrate for low cost RF SOP applications. PCB embedded spiral inductors, MIM capac...
In this paper, embedded passive components are investigated into the PCB substrate for low cost RF SOP applications. PCB embedded spiral inductors, MIM capac...
In this paper, electroplating, screen-printing, and surface micromachining technologies are utilized to realize integrated high frequency inductors with comp...
In this paper, ultra-low voltage operated piezoelectric RF MEMS in-line dc contact switches with serial and shunt configurations have been realized by using ...